Volume 12, Issue 3 (8-2012)                   Modares Mechanical Engineering 2012, 12(3): 103-116 | Back to browse issues page

XML Persian Abstract Print


Download citation:
BibTeX | RIS | EndNote | Medlars | ProCite | Reference Manager | RefWorks
Send citation to:

Studying the Effect of Part Thickness on Cracking during Drying Process. Modares Mechanical Engineering 2012; 12 (3) :103-116
URL: http://mme.modares.ac.ir/article-15-2567-en.html
Abstract:   (5041 Views)
Drying process is influenced by a variety of parameters including the geometry of part being dried. To evaluate the effect of part geometry on drying process, and resultant defects, the process is analyzed and studied. Based on the assumption related to the porous media the governing equation of the mass transfer and static equilibrium are presented. The mechanical stresses generated by the drying strains are expressed according to the linear-elastic model. Dependence of physical and mechanical properties such as Young's modulus and diffusion coefficient as a function of moisture are considered in simulation for a chemically known ceramic material. it’s Assumed that Extended thin film evaporation is the mechanism of evaporation in constant rate period has been studied. The Von Misses criterion is used for crack anticipation in 2D and 3D drying. A significant difference was observed in possibility of crack initiation for the two different configurations. Yield stress in hygroscopic moisture has been determined experimentally. Developed model made it possible to predict the time and the place of crack initiation. Different part thicknesses were studied to examine the effect of thicknesses variations on cracking. It is observed that the danger of cracking is highest at the beginning of the drying, since the yield stress is low.
Full-Text [PDF 2484 kb]   (5367 Downloads)    

Received: 2012/01/8 | Accepted: 2012/03/11 | Published: 2012/09/10

Add your comments about this article : Your username or Email:
CAPTCHA

Rights and permissions
Creative Commons License This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.