Volume 15, Issue 12 (2-2016)
Modares Mechanical Engineering 2016, 15(12): 159-167 |
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Mirza Gheitaghy A, Saffari H, Salehi J. Pool boiling enhancement by electrodeposited porous micro/nanostructured on copper surface. Modares Mechanical Engineering 2016; 15 (12) :159-167
URL: http://mme.modares.ac.ir/article-15-1193-en.html
URL: http://mme.modares.ac.ir/article-15-1193-en.html
1- School of Mechanical Engineering, Iran University of Science and Technology
2- Associate Prof., Head of Department, School of Mechanical Engineering/ Iran University of Science and Technology
2- Associate Prof., Head of Department, School of Mechanical Engineering/ Iran University of Science and Technology
Abstract: (6664 Views)
Boiling is a remarkably efficient heat transfer method and is commonly used in daily life and industrial applications. Changing the physical and chemical structure of hot surface in some methods as making a porosity in a manner of enhancing boiling process is an interesting topic in recent decay. In this paper, porous metal micro/nano structural surfaces is produced in order to augmentation of boiling heat transfer on copper surface by the one- and two-stage electrodeposition method. The pictures in micro and nanoscale are captured to identification of structure and surface characteristics as porosity and capillarity are estimated. Next, the effects of structures in enhancing the pool boiling are measured experimentally. So then, boiling heat transfer profiles that demonstrate heat flux versus wall superheat, are derived for water fluid. Pool boiling curves of enhanced surfaces is compared with polished surface and results of other researchers to determine the efficiency improvement. Furthermore, comparison the effect of electrodeposition process time on obtained structures shows higher porosity, capillary and strength of structure with lower process time (30 sec) lead to further enhancement of pool boiling.
Article Type: Research Article |
Subject:
Heat & Mass Transfer
Received: 2015/09/1 | Accepted: 2015/10/6 | Published: 2015/11/21
Received: 2015/09/1 | Accepted: 2015/10/6 | Published: 2015/11/21
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