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Effects of different inlet/outlet arrangements on thermal performance of porous microchannel heat sink MCHS of any geometry has not been studied yet. In this investigation, the effects of utilization of four different inlet/outlet arrangements on electronic chip cooling utilizing trapezoidal MCHS with porous microchannels with porosity of 0.88 have been studied numerically. For this purpose, three dimensional simulations of laminar forced convection flow in microchannels and conduction in solid parts of MCHS by applying constant heat flux of 150 kWm-2 at its base plate have been performed utilizing the finite volume method and the commercial Ansys-CFX code. The results show that the A- and B-type arrangements, for wich the inlet and outlet are in direction of flow in the microchannels, have a better heat transfer performance, smaller thermal resistance and provide more uniform temperature distribution in the MCHS base plate. The results indicate that using porous media is effective in reducing the MCHS base plate temperature and in this regard the D-type arrangement has the best performance among the heat sinks studied. Considering both the positive effect of using porous media on increasing the heat transfer coefficient and its negative effect on increasing the required pumping power, the A-type arrangement has the best performance.

Keywords: Cooling, Porous microchannel heat sink, Inlet/outlet arrangements, Trapezoidal microchannel

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