Bimetallic Copper clad aluminum according to standard ASTM B566 can be used in telecommunication networks and signal transmission. The quality of this product in terms of bonded layer’s, in reference standard is important. The interlayer pressure affected during the drawing process on the quality of bonded layer’s. Sample of Bimetallic wire in 9.5 mm diameters was produced by Copper clad with thickness of 0.45 mm. Bimetal wire formed by wire drawing process with 6.2% reduction in area. In this study the effect of tow parameters of wire drawing process: semi die angle and reduction of area on interlayer pressure using ANSYS 17 for simulation is examined. .By comparing the force-displacement curve in experimental and modeling works, simulation accuracy was good. During the investigation it was found always with reduce reduction of area, percent of the maximum interlayer pressure depend on semi die angle. So that by increases of reduction in area for 5 degrees semi die angle, interlayer pressure does not change. But, for 45 degrees semi die angle the worst effect of reduction in area changes in interlayer pressure is sudden. The pressure changes with increased the semi die angle, depends on the reduction of area. So that the maximum interlayer pressure in 6.2% reduction in area is decreased with increases of semi die angle between 5 to 45 degrees; But, the interlayer pressure in 20% reduction in area, increases with increasing the semi die angle.