We know, cantilevers are based for the most of the MEMS components, in this paper, the fabrication process of SiO2 micro cantilever array based on bulk micromachining technology is introduced. The results of which can be used to fabricate of SiO2 micro cantilever sensors. The micro-cantilever fabrication process is implemented in the 13th stage with two glass and talcous masks and it is also suspend by wet release technique. The main advantages of the proposed method can be expressed no need for advanced deposition equipment, design with minimum mask, fast and simplicity in implementation of the micro cantilever, avoid of complexity release from sacrificial layer, release the micro cantilever at environment temperature, low cost price and finally possible to implement in microelectronics research laboratories with limited equipment. The SiO2 micro cantilevers fabricate with 1and 2µm thickness, 50, 100, 150, 200, 250, 300, 350 and 400μm lengths, and 20 and 40µm widths. The resonant frequency and the spring constant values are also calculated for different materials (Si3N4, Si, Au, SiO2, Al and SU8) with various sizes. The SEM images results show that the lithographic process is correctly done on the roughness of the backside substrate, the fabrication process and Si etching operations controls are performed suitable, and micro-cantilevers are suspended with negligible stress.