Volume 14, Issue 16 (Forth Special Issue 2015)                   Modares Mechanical Engineering 2015, 14(16): 349-357 | Back to browse issues page

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SeyedKazem Viliani N, Hashemi M, Vadizadeh H, Pourrostami H, Mostafavi S M, Hashemizadeh F. Modelling and empirical investigation of micro-electro-mechanical piezo-resisitive pressure sensor based on the requirements of petrochemical industry. Modares Mechanical Engineering 2015; 14 (16) :349-357
URL: http://mme.modares.ac.ir/article-15-8509-en.html
Abstract:   (6289 Views)
This article presents analytical and empirical studies of a micro-electromechanical package. This micro-electro-mechanical (MEMS) pressure sensor package contains of a printed circuit board (PCB), the capacitance LCD. First of all, mathematical modeling and computer simulation using software COMSOL software which is based on finite element method are presented to compute the sensitivity of the MEMS pressure sensor and output voltage output. It is worth noting that an Xducer resistor type is adopted to measure the diaphragm deflection. In addition to static and modal analyses of the sensor, the effects of geometric parameters on the voltage has also been studied. Simulation results show that by changing the size and position of the resistor and also the size and thickness of the diaphragm, sensor sensitivity can be changed. Then, with the construction and placement of components on printed circuit boards, the package has been prepared and tested in a laboratory. The experimental results of the package show that the error of the devised system in measuring the pressure is less than 0.5 percent. This pressure sensor package is capable of accurately measuring the pressure up to 6 bar in which all the empirical results are presented at the end of the study. The package can be designed according to the requirements of the petrochemical industry in measuring gas pressure of storage tanks and drums in FANAVARN petrochemical company.
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Article Type: Research Article | Subject: Instrumentation|Vibration|Micro & Nano Systems|Mechatronics
Received: 2014/07/5 | Accepted: 2014/08/15 | Published: 2014/11/15

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