Nowadays with the increase of the power of electronic components, their heat generation rates have also increased therefore, therefore it is necessary to use new methods to cooling different parts. One of the solutions to cool the high-power components is the use of vapor chambers. The vapor chamber consists of three sections, the evaporation, the middle and the condensation section, which are flattened and can transfer a significant amount of heat without the need for external power and only by using a fluid phase change. In this study, two vapor chambers with a length and width of 120 mm and a height of 15 mm were made to cool the high-power printed circuit board, where the evaporation section of one of them was roughened and the condensation section is cooled down by the fin and through the air. In this research, the effect of roughening the evaporation section, the angle of the vapor chamber relative to the horizon, different heat input and the geometric deformation of the heat source in the fixed area, as well as changing the location of the heat source in the evaporation section, on the thermal performance of the vapor chamber, is experimentally reviewed and compared. The results of the experiments show that increasing the heat input and roughing the evaporation section improves the performance of the vapor chamber and the thermal resistance of the vapor chamber is also the function of changing its angle relative to the horizon, deformation, and location of the thermal source.

Using vapor chambers is a useful way to control the temperature of electronic components. In this study, two vapor chambers with identical dimensions have been tested. The condensation part of one of them is hydrophobic, the second is simple and there is no hydrophobic operation. In this study, the effect of lateral surface insulation on both vapor chambers, the effect of other parameters, including vapor chamber angle with the horizon, different heat loads produced by the heat source (printed circuit board), geometric deformation of the heat source in a fixed area, and also, change the location of the heat source installation on the evaporator floor, on the thermal performance of the vapor chamber, due to the hydrophobicity of the condensation part of the vapor chamber, has been studied as experimental work and compared with the simple vapor chamber. Also, the impact of installing the heat source on the entire floor of the evaporation section, by increasing the area of it, in both vapor chambers have been investigated. Experimental results show that hydrophobicity and increase of heat, in total and in most cases, decrease the thermal resistance of the vapor chamber. The thermal performance of the vapor chamber has also been improved by installing the printed circuit board across the evaporator floor and it depends on other parameters investigated in this study. Also, insulating the side surfaces, increases the thermal resistance in the simple vapor chamber and reduces thermal resistance in the vapor chamber with the hydrophobic condensation section.