Modares Mechanical Engineering

Modares Mechanical Engineering

Analytical Investigation of Induced Stresses on Solder Joints of Electronic Boards under Random Vibration

Authors
mahdi fakoor 1
Farzad Shirmohamadli 2
1 University of Tehran
2 Faculty of New Sciences and Technologies
Abstract
The satellites on the ground during construction and transportation, in launching stage and operation in space are under various types of dynamic loads, including high and low frequency vibrational loads, acoustics, shock, impact, etc., each of which can be an important source in the creation of stress on the satellite. The satellite components should be designed in such a way that can continue to operate while facing these situations. Electronic boards, in particular their solder joints, are critical components of satellites. Therefore, investigation of damage in design process of boards have great importance. Loading pattern on the satellite during its operation is usually random which considered as quasi-static load. Improvement of the design of the satellite against the weaknesses shown while facing different loads is essential, and given the fact that it is time consuming and costly to carry out laboratory tests, the use of analytical methods for checking the strength and lifetime of the structure can be very useful. In this research, random vibrations environment is equivalent to pseudo-static loads, and using the multilayer plate theory, the stresses in solder joints and failure of joints under this loading will be investigated. Also, the effect of parameters such as electronic board width and the boundary condition of the printed circuit board on the solder joints' stress will be considered in analytical solution.
Keywords
Electronic board
Solder joint
random vibration
Stress Analysis

Subjects

[1] R. C. Leibowitz, Vibroacoustic response of turbulence excited thin rectangular finite plates in heavy and light fluid media. Journal of sound and Vibration, Vol. 40, No. 4, pp. 441-495, 1975.
[2] I. Elishakoff, Random vibrations of orthotropic plates clamped or simply supported all round. Acta Mechanica, Vol. 28, No. 1, pp. 165-176,‌ 1977.
[3] J. Miao and Y. Ouyang, The response of a clamped rectangular plate with viscous damping and non-linear structural damping, Acta Mech. Sinica, pp. 469_479, 1983
[4] G. Maymon, Random response of indeterministic structures subjected to stationary random excitation: a practical engineering solution. Journal of sound and vibration, Vol. 172, No. 2, pp. 211-229, 1994.
[5] W. Huang, D. B. Kececioglu and J. L. Prince, A simplified random vibration analysis on portable electronic products. IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 505-515,‌ 2000.
[6] Y. Xing and B. Liu, New exact solutions for free vibrations of rectangular thin plates by symplectic dual method. Acta Mechanica Sinica, Vol. 25, No. 2, pp. 265-270, 2009.
[7] S. Irani and S. Sazesh, Random vibration of tapered beam under stochastic excitation, Modares Mechanical Engineering, Vol. 13, No. 3, pp. 138-154, 2012. (in Persianفارسی )
[8] A. H. Hosseinloo, F. F. Yap and N.Vahdati, Analytical random vibration analysis of boundary-excited thin rectangular plates. International Journal of Structural Stability and Dynamics, Vol. 13, No. 3, 1250062,‌ 2013.
[9] G. Chen, J. Zhou, & D. Yang, Benchmark solutions of stationary random vibration for rectangular thin plate based on discrete analytical method. Probabilistic Engineering Mechanics, Vol. 50, pp. 17-24, 2017.
[10] O. Volkersen, Die Nietkraftverteilung in zugbeanspruchten Nietverbindungen mit konstanten Laschenquerschnitten. Luftfahrtforschung, Vol. 15, No. 1/2, pp. 41-47, 1938.
[11] M. Goland and E. Reissner, The stresses in cemented joints. Journal of applied mechanics, Vol. 11, No. 1, pp. 17-27, 1944.
[12] R. W. Cornell, Determination of stresses in cemented lap joints. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, Vol. 20, No. 3, pp. 355-364, 1953.
[13] F. Delale, F. Erdogan and M. N. Aydinoglu, Stresses in adhesively bonded joints: a closed-form solution. Journal of Composite Materials, Vol. 15, No. 3, pp. 249-271, 1981.
[14]E. Suhir, On a paradoxical phenomenon related to beams on elastic foundation: Could external compliant leads reduce the strength of a surface-mounted device?. Journal of applied mechanics, Vol. 55, No. 2, pp. 818-821, 1988.
[15] D. A. Bigwood, and A. D. Crocombe, Elastic analysis and engineering design formulae for bonded joints. International journal of Adhesion and Adhesives, Vol. 9, No. 4, pp. 229-242, 1989.
[16] D. B. Barker, Local PWB and component bowing of an assembly subjected to a bending moment. Journal of Electronic Packaging, Vol. 116, No. 2, pp. 92-97, 1994.
[17] E. H. Wong, and C. K. Wong, Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending. International Journal of Mechanical Sciences, Vol. 51, No. 2, pp. 152-158, 2009.
[18] Y. Ping, Z. Jie, W. Dongyang and B. Binghao, Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load. International Journal of Materials and Product Technology, Vol. 31, No. 2, pp. 293-304, 2008.
[19]M. A. Gharaibeh, Q. T. Su, & J. M. Pitarresi, Analytical solution for electronic assemblies under vibration. Journal of Electronic Packaging, Vol. 138, No. 1, 2016.
[20] M. L. Wu and J. S. Lan, Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment. Soldering & Surface Mount Technology, Vol. 29, No. 2,pp. 75-84, 2017.
[21]R. Ghaffarian, CCGA packages for space applications, Microelectronics Reliability, Vol. 46, No. 12, 2006.
Modares Mechanical Engineering
Volume 18, Issue 6
October 2018
Pages 41-48